{
  "$type": "site.standard.document",
  "description": "A method of preparing a precursor for a composite having wet strength of 2 to 50 kgf/mm and a mean surface void diameter of 0.01 to 2 mu m by molding a solution of a rigid polymer having a concentration of 1 to 1.3 times the optical anisotropy lower limit solution concentration C2, thereafter…",
  "path": "/patents/1090134",
  "publishedAt": "2004-01-28T00:00:00.000Z",
  "site": "at://did:plc:oql6ds5vnff4ugar6rruliwd/site.standard.publication/3mn3ohu7oxx5w",
  "tags": [
    "C08J5/00",
    "TOYO BOSEKI [JP]"
  ],
  "textContent": "A method of preparing a precursor for a composite having wet strength of 2 to 50 kgf/mm and a mean surface void diameter of 0.01 to 2 mu m by molding a solution of a rigid polymer having a concentration of 1 to 1.3 times the optical anisotropy lower limit solution concentration C2, thereafter rendering the solution non-flowable by absorbing a coagulant under a condition causing no solvent extraction and thereafter extracting the solvent, and a method of preparing a molecular composite having a mean thickness of 2 to 200 mu m by impregnating this precursor for a composite with a solution of a polymer or reactive molecules.",
  "title": "PROCESS FOR PRODUCING COMPOSITE FROM SOLUTION OF RIGID POLYMER AND COMPOSITE FILM"
}