A mounting structure includes base wall formed of a thermally conductive material and configured to provide a thermally conductive pathway between an electronic device mounted to an inner side of the base wall and a panel in contact with an outer side of the base wall that is opposite the inner side. The outer side includes a plurality of bumps configured to engage the panel. The base wall includes a plurality of tabs. Each tab configured to receive a corresponding fastener to secure the base wall to the panel.
