TSMC is executing the largest manufacturing expansion in semiconductor industry history that combines simultaneous multi-fab N2 ramps, AI-driven manufacturing optimizations, and massive CoWoS/SoIC packaging capacity expansion to meet increasing demand for AI accelerators.
Chinese startup Prinano claims it produced 8-inch photonic chip wafers without DUV lithography, using nanoimprint technology that cuts costs by 90%.
TSMC says it does not have enough capacity to handle all the demand from AI hyperscalers, with CEO C.C. Wei saying that it will take a long time before it can match customer demand. This is an opportunity for Intel, though, as companies desperate to get their hands on advanced chips might be willing to use Intel 18A or 14A nodes for their needs instead.
For much of the past two decades, Europe’s influence in the global technology industry has stemmed less from the companies it produced than from the rules it imposed. While Silicon Valley created the world’s dominant digital platforms and China built a state-backed technology ecosystem of its own, Brussels became known primarily as the global regulator […]
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Samsung displayed its first physical mockup of HBM5 memory at Computex 2026 in Taipei, pairing the eighth-generation AI memory with a new in-package cooling structure.
South Korea's stock market has now ascended to become the world's sixth-largest, surpassing India's market capitalization. The surge is largely attributed to the booming artificial intelligence sector and key semiconductor manufacturing giants.
Thousands of SK hynix employees fled their factory stations earlier today as a fire broke out in a room where fluorine gas was used.
TikTok owner Bytedance reportedly developing its own custom CPUs in a bid to reduce costs and dependence from US chipmakers
We explore Globalfoundries, UMC, and SMIC's individual trailing-edge roadmaps, as each company is pursuing a fundamentally different strategy shaped by geography, regulation, and technology choices.
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
Runaway profits and sky-high valuations for microchip companies have fuelled worker demands over pay packages in South Korea, raising the question: who profits from the artificial intelligence boom? In the United States, some employees with stock options have made it rich and retired early, while in Asia chip engineers are now using their “immense” leverage […]
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The certifications are valid for three years and were issued jointly by the China Information Technology Security Evaluation Centre and the National Secrecy Science and Technology Evaluation Centre.
Samsung Electronics’ labour union is expected to announce Wednesday whether chip workers voted to ratify a wage deal that would deliver massive AI-linked bonuses and helped avert a major strike. The tentative agreement between the South Korean memory chip giant and its largest union federation over a new bonus scheme for employees in the semiconductor […]
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SK hynix has unveiled iHBM, a new thermal packaging architecture that embeds cooling elements directly into the HBM interface layer, reducing thermal resistance by 30% and helping future AI accelerators avoid performance-killing thermal throttling.
Imec unveiled the world’s first silicon quantum dot qubit device fabricated with High-NA EUV lithography, suggesting quantum computing may eventually scale using the semiconductor industry’s existing advanced manufacturing ecosystem.
Huawei Technologies unveiled a new “LogicFolding” chip design framework built on its proprietary Tau scaling law, claiming it can dramatically boost transistor density and power efficiency without EUV lithography — potentially helping China narrow the gap with TSMC and Nvidia despite U.S. sanctions.
Huawei’s newest semiconductor claim is not just about making chips smaller. It is an attempt to move the industry’s scoreboard away from foundry node names and toward a metric China may have more room to control: how quickly signals and data move through a chip system. At the 2026 IEEE International Symposium on Circuits and […]
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It’s understood that meetings are being canceled across Samsung's non-memory and shared business units.
ASIC-based AI server shipments are projected to reach 27.8% of the market in 2026, the highest share since 2023, and custom ASIC shipments will grow 44.6% year-over-year.
AMD has announced that its 6th Gen EPYC processor, codenamed Venice, has entered production ramp on TSMC's N2 process in Taiwan.
Discover how the ZEISS Crossbeam 750 FIBSEM sets a new benchmark for precise TEM lamella prep, tomography, and advanced nanofabrication. This delivers better resolution, better SNR, larger usable FOV, and shorter acquisition times. Learn how uninterrupted FIB milling will reduce damage and rework, accelerate time to TEM, and increase first pass success—so your FA, yield, and materials teams…
A group of Samsung Electronics shareholders on Thursday vowed legal action against a tentative deal between the South Korean chip giant and its largest labour union that averted a major strike. The last-minute agreement on bonuses — which union members will vote on — was struck late Wednesday, with plans for an 18-day strike from […]
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Intel says its 14A process technology is on track for high-volume manufacturing in 2029, 10A and 7A to follow in the 2030s.
China's semiconductor equipment vendors collectively posted record revenues in 2025, but profitability is under pressure from domestic price competition.
Russia’s Mikron is earning a bit of cash on the side by selling picture-framed test wafers as souvenirs with 12 designs to choose from, priced around $170.
Trump's remarks came at the close of a two-day summit with Chinese President Xi Jinping.
All three leading foundries have now entered the 2nm era, but their paths from now on diverge sharply: TSMC bets on predictability, Intel wagers on aggressive architectural shifts, and Samsung's primary focus is on improving yields.
_This sponsored article is brought to you by Applied Materials._
At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required a new operating paradigm: Concentrate the world’s best talent around a single mission, establish a common platform, share critical…
The UAE has signed a strategic agreement with US defence giant Lockheed Martin to establish an advanced chiplet design and microelectronics assembly facility in Abu Dhabi, strengthening the country’s ambitions to localise next-generation defence and semiconductor technologies. The agreement, announced during the “Make it in the Emirates 2026” forum, marks a significant step in the […]
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TSMC's Fab 21 becomes profitable in the first year of operations, though TSMC continues to struggle with labor shortage, water shortage, and is concerned about the long-term power supply. Nevertheless, it allocates $20 billion on further development of the project.