Altera’s wideband Agilex 9 Direct RF-Series AGRW039 SoC FPGA is designed for high-performance Radio Frequency (RF) systems in aerospace, defense, and advanced communications systems. It is the fourth device in Altera’s Agilex 9 Direct RF-Series, and compared to the previous generation AGRW027, the new AGRW039 delivers about 45% more logic resources, 45% more DSP resources, and 43% more block RAM.…

Thundercomm has launched the TurboX C7790 development kit, a compact edge AI platform built around the Qualcomm Dragonwing Q-7790 (CQ7790S) processor. The kit offers up to 24 TOPS of AI performance and support for both Android and Linux operating systems. The development kit pairs a TurboX C7790 system-on-module equipped with 12GB LPDDR5X RAM and 128GB flash with a carrier board featuring a wide…

ADLINK OSM-MTK520 is a 45 x 45mm OSM Size-L system-on-module (SoM) powered by a MediaTek Genio 520 AIoT processor with a 10 TOPS NPU for Edge AI workloads. It’s basically an upgrade to the company’s OSM-MTK510 OSM Size-L module with a Genio 510 hexa-core SoC (3.2 TOPS NPU), up to 32GB eMMC flash, and 8GB LPDDR4 with a Genio 520 octa-core SoC (10 TOPS NPU), up to 256GB or 512GB UFS 3.1 storage,…

Toradex has launched two new ultra-compact (30x30mm) System-on-Module (SoM) families: OSM and Lino, powered by NXP i.MX 91 or i.MX 93 Arm Cortex-A55 SoC for Edge industrial and IoT applications. The OSM iMX91 and OSM iMX93 variants comply with the OSM Size-S standard, featuring a 332-ball contact grid designed to be soldered to the carrier board. The Lino is a proprietary format that keeps the…

As common as the Xbox 360 was, the development kits (XDKs) for these consoles are significantly less so. This makes it even more tragic when someone performs a botched surgery …read more