Samsung has started shipping industry first HBM4E memory samples as the AI infrastructure race pushes demand for faster bandwidth, better thermals, and improved power efficiency in next generation data centers.

SK hynix has introduced iHBM, a new thermal solution designed for future HBM5 memory chips. The company says the technology improves heat dissipation and helps AI hardware stay stable under demanding workloads.

If you think AI progress is all about GPUs, you are missing half the story. Memory is quickly becoming the real choke point, and SK hynix seems eager to cash in on that. The company says it has kicked off mass production of a 192GB SOCAMM2 module built on its latest 1cnm LPDDR5X DRAM. That ... Read more