Shuttle XPC cube SB860R8 targets workstation workloads with Core Ultra 200 support

Shuttle’s new XPC cube SB860R8 is a 14-liter barebone system supporting Intel Core Ultra 200 series processors. Key features include up to 192 GB DDR5 memory, four 3.5-inch drive bays, PCIe Gen5 expansion, dual 2.5 GbE, and multiple display outputs including HDMI 2.1 with 8K support. The system is built around the LGA1851 socket for […]

Shuttle XPC slim DB860 Leverages Core Ultra 200 in Compact 1.3L Barebone

Shuttle has revealed the XPC slim DB860, a compact 1.35-liter barebone system built around Intel Core Ultra 200 series processors. The system provides desktop-class performance in a compact metal chassis and supports continuous operation. The platform supports Intel Core Ultra 200 processors (Arrow Lake-S) using the LGA1851 socket, with a maximum TDP of 65 W. […]

M5StampS3 BAT Module Combines ESP32-S3 and Battery Management

M5Stack has added the M5StampS3 BAT, a compact embedded module based on the ESP32-S3 platform with integrated battery power management. The module is intended for IoT and low-power applications requiring wireless connectivity and flexible GPIO access in a small form factor. The module is built around the ESP32-S3-PICO-1-N8R8 system-in-package, featuring a dual-core Xtensa LX7 processor […]

Shuttle XB860G2 and XH810 Slim Systems Arrive with Intel Core Ultra 200 CPUs

Shuttle has added two systems to its XPC slim lineup, the XB860G2 and XH810, both based on Intel Core Ultra 200 series processors. The systems are offered as compact barebone platforms for embedded, industrial, and general-purpose computing applications. Both models use the LGA1851 socket and support Intel Core Ultra 200 series processors (Arrow Lake-S) with […]

Page 1